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AMD Ryzen 5 7535HS

vs

AMD Ryzen 5 4600H

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 5 7535HS and AMD Ryzen 5 4600H processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 5 7535HS

Higher Max Turbo Frequency: Up to 4.55 GHz (Up to 4.55 GHz vs Up to 4.0GHz)
Larger L3 Cache: 16 MB (16 MB vs 8MB)
Higher Technology: TSMC 6nm FinFET (TSMC 6nm FinFET vs TSMC 7nm FinFET)
Newer PCI Express Version: PCIe® 4.0 (PCIe® 4.0 vs PCIe® 3.0)
Higher Memory Type: DDR5, LPDDR5 (DDR5, LPDDR5 vs DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s)
Newer Launch Date: April 2023 (April 2023 vs January 2020)

Basic

AMD

Label Name

AMD

April 2023

Launch Date

January 2020

Laptop

Platform

Laptop

Ryzen 5 7535HS

Model Name

Rembrandt R

Code Name

Renoir

Zen 3+

Generation

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

OS Support

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

3.3 GHz

Basic Frequency

3.0GHz

Up to 4.55 GHz

Max Turbo Frequency

Up to 4.0GHz

512 KB

L1 Cache

3 MB

L2 Cache

3MB

16 MB

L3 Cache

8MB

FP7

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP6

Unlocked for Overclocking

TSMC 6nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 7nm FinFET

35-54W

TDP

45W

95°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

105°C

PCIe® 4.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 3.0

x86-64

Instruction Set

An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.

Memory Specifications

DDR5, LPDDR5

Memory Type

DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s

64 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

4x1R DDR5-4800

Maximum Memory Speed

Yes (Requires platform support)

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

AMD Radeon™ 660M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ Graphics

Graphics Core Count

1900 MHz

Graphics Frequency

1500 MHz