Home / CPU Comparison / AMD Ryzen 5 7430U or AMD Ryzen 7 7445HS: What's better?

AMD Ryzen 5 7430U

vs

AMD Ryzen 7 7445HS

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 5 7430U and AMD Ryzen 7 7445HS processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 5 7430U

Newer Launch Date: October 2023 (October 2023 vs May 2023)

AMD Ryzen 7 7445HS

Higher Max Turbo Frequency: 4.7 GHz (4.3 GHz vs 4.7 GHz)
Higher Technology: TSMC 4nm FinFET (TSMC 7nm FinFET vs TSMC 4nm FinFET)
Newer PCI Express Version: PCIe® 4.0 (PCIe® 3.0 vs PCIe® 4.0)
Higher Memory Type: DDR5 (FP7r2), LPDDR5X (FP7-FP8) (DDR4 vs DDR5 (FP7r2), LPDDR5X (FP7-FP8))

Basic

AMD

Label Name

AMD

October 2023

Launch Date

May 2023

Laptop

Platform

Laptop

Ryzen 5 7430U

Model Name

Ryzen 7 7445HS

Barcelo R

Code Name

Phoenix

Zen 3

Generation

2x Zen 4, 4x Zen 4c

Windows 11 - 64-Bit EditionWindows 10 - 64-Bit EditionRHEL x86 64-BitUbuntu x86 64-Bit

OS Support

RHEL x86 64-BitUbuntu x86 64-BitWindows 11 - 64-Bit EditionWindows 10 - 64-Bit Edition

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

2.3 GHz

Basic Frequency

3.55 GHz

4.3 GHz

Max Turbo Frequency

4.7 GHz

384 KB

L1 Cache

3 MB

L2 Cache

6 MB

16 MB

L3 Cache

16 MB

FP6

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP7, FP7r2

Unlocked for Overclocking

TSMC 7nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 4nm FinFET

TDP

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100

PCIe® 3.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 4.0

x86-64

Instruction Set

An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.

x86-64

Memory Specifications

DDR4

Memory Type

DDR5 (FP7r2), LPDDR5X (FP7-FP8)

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

256

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

2x1R DDR4-3200, LPDDR4X-4267

Maximum Memory Speed

4x2R DDR5-5600, LPDDR5x-7500

Yes (Requires platform support)

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

AMD Radeon™ Graphics

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ 740M

Graphics Core Count

1800

Graphics Frequency

2700