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AMD Ryzen 5 4500 vs AMD Ryzen 7 5700X3D

AMD Ryzen 5 4500

AMD Ryzen 7 5700X3D

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 5 4500 and AMD Ryzen 7 5700X3D processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 7 5700X3D

More Total Cores: 8 (6 vs 8)
Larger L3 Cache: 96 MB (shared) (8MB vs 96 MB (shared))
Newer PCI Express Version: Gen 4, 20 Lanes (CPU only) (PCIe 3.0 vs Gen 4, 20 Lanes (CPU only))
Newer Launch Date: January 2024 (April 2022 vs January 2024)

Basic

AMD

Label Name

AMD

April 2022

Launch Date

January 2024

Desktop

Platform

Desktop

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Ryzen 7 5700X3D

Renoir

Code Name

Vermeer

Generation

Ryzen 7 (Zen 3 (Vermeer))

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

3.6GHz

Basic Frequency

3 GHz

Up to 4.1GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

up to 4.1 GHz

384KB

L1 Cache

64 KB (per core)

3MB

L2 Cache

512 KB (per core)

8MB

L3 Cache

96 MB (shared)

Multiplier Unlocked

AM4

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AMD Socket AM4

Bus Frequency

100 MHz

Multiplier

30.0x

Yes

Unlocked for Overclocking

AMD`s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26.

TSMC 7nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

7 nm

65W

TDP

105 W

95°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

90°C

PCIe 3.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Gen 4, 20 Lanes (CPU only)

Transistors

8,850 million

Memory Specifications

DDR4

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR4

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Dual-channel

Up to 3200MT/s

Bus Speed

ECC Memory

Yes

GPU Specifications

Discrete Graphics Card Required

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

N/A

Miscellaneous

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

OS Support