Advantages
- Higher Technology: TSMC 6nm FinFET (TSMC 6nm FinFET vs 10 nm)
- Newer Launch Date: October 2025 (October 2025 vs January 2025)
- More Total Cores: 10 (4 vs 10)
- Larger L3 Cache: 12 MB (shared) (4 MB vs 12 MB (shared))
- Newer PCI Express Version: Gen 4, 8 Lanes (CPU only) (PCIe® 3.0 vs Gen 4, 8 Lanes (CPU only))
Basic
AMD
Label Name
Intel
October 2025
Launch Date
January 2025
Laptop
Platform
Mobile
Ryzen 5 40
Model Name
Core 5 220U
Mendocino
Code Name
Raptor Lake-U
Zen 2
Generation
Core 5 (Raptor Lake-U)
Ubuntu x86 64-Bit, Windows 11 - 64-Bit Edition
OS Support
-
CPU Specifications
4
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
10
8
Total Threads
12
-
Performance-cores
2
-
Efficient-cores
8
2.8 GHz
Basic Frequency
-
Up to 4.3 GHz
Max Turbo Frequency
-
-
Performance-core Base Frequency
1500 MHz
-
Efficient-core Base Frequency
900 MHz up to 3.9 GHz
-
Performance-core Max Turbo Frequency
up to 5 GHz
256 KB
L1 Cache
80 KB (per core)
2 MB
L2 Cache
1.25 MB (per core)
4 MB
L3 Cache
12 MB (shared)
-
Bus Frequency
100 MHz
FT6
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Intel BGA 1744
-
Multiplier
14.0x
-
Multiplier Unlocked
No
No
Unlocked for Overclocking
-
TSMC 6nm FinFET
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
10 nm
15W
TDP
15 W
-
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
100°C
PCIe® 3.0
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
Gen 4, 8 Lanes (CPU only)
x86-64
Instruction Set
An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.
-
Memory Specifications
LPDDR5
Memory Type
DDR4, DDR5
-
LPDDR5 Speed
6400 MT/s
16 GB
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
-
2
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Dual-channel
2x1R LPDDR5-5500
Maximum Memory Speed
-
-
ECC Memory Support
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
No
GPU Specifications
AMD Radeon™ 610M
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
Intel® Graphics
2
Graphics Core Count
-
1900 MHz
Graphics Frequency
-
Miscellaneous
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