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AMD Ryzen 3 PRO 4350G

vs

AMD Ryzen 7 260

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 3 PRO 4350G and AMD Ryzen 7 260 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 7 260

More Total Cores: 8 (4 vs 8)
Higher Max Turbo Frequency: Up to 5.1 GHz (Up to 4.0GHz vs Up to 5.1 GHz)
Larger L3 Cache: 16 MB (4MB vs 16 MB)
Higher Technology: TSMC 4nm FinFET (TSMC 7nm FinFET vs TSMC 4nm FinFET)
Newer PCI Express Version: PCIe® 4.0 (PCIe® 3.0 vs PCIe® 4.0)
Higher Memory Type: DDR5 (FP8), LPDDR5X (FP8), LPDDR5X (FP7), DDR5 (FP7r2) (DDR4 vs DDR5 (FP8), LPDDR5X (FP8), LPDDR5X (FP7), DDR5 (FP7r2))
Newer Launch Date: February 2025 (July 2020 vs February 2025)

Basic

AMD

Label Name

AMD

July 2020

Launch Date

February 2025

Desktop

Platform

Laptop

Model Name

Ryzen 7 260

Renoir

Code Name

Hawk Point

Generation

Zen 4

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

OS Support

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

3.8GHz

Basic Frequency

3.8 GHz

Up to 4.0GHz

Max Turbo Frequency

Up to 5.1 GHz

256KB

L1 Cache

2MB

L2 Cache

8 MB

4MB

L3 Cache

16 MB

AM4

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP8, FP7r2, FP7

Unlocked for Overclocking

TSMC 7nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 4nm FinFET

65W

TDP

45W

95°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

PCIe® 3.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 4.0

Memory Specifications

DDR4

Memory Type

DDR5 (FP8), LPDDR5X (FP8), LPDDR5X (FP7), DDR5 (FP7r2)

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

256 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Up to 3200MT/s

Bus Speed

Maximum Memory Speed

4x2R DDR5-5600

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

Radeon™ Graphics

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ 780M

Graphics Core Count

1700 MHz

Graphics Frequency

2700 MHz