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AMD PRO A8-8650B

vs

AMD A6-6400B

CPU Comparison Result

Below are the results of a comparison of AMD PRO A8-8650B and AMD A6-6400B processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD PRO A8-8650B

More Total Cores: 4 (4 vs 2)
Higher Technology: 28 nm (28 nm vs 32 nm)
Newer PCI Express Version: Gen 3, 16 Lanes (CPU only) (Gen 3, 16 Lanes (CPU only) vs Gen 2)
Newer Launch Date: September 2015 (September 2015 vs June 2013)

AMD A6-6400B

Higher Max Turbo Frequency: up to 4.1 GHz (up to 3.9 GHz vs up to 4.1 GHz)

Basic

AMD

Label Name

AMD

September 2015

Launch Date

June 2013

Desktop

Platform

Desktop

PRO A8-8650B

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

A6-6400B

Godaveri

Code Name

Richland

A8 (Godaveri)

Generation

A6 (Richland)

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

3.2 GHz

Basic Frequency

3.9 GHz

up to 3.9 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

up to 4.1 GHz

256 KB

L1 Cache

96 KB

4 MB

L2 Cache

1 MB (shared)

100 MHz

Bus Frequency

100 MHz

AMD Socket FM2+

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AMD Socket FM2

32.0x

Multiplier

39.0x

Multiplier Unlocked

Yes

28 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

32 nm

65 W

TDP

65 W

Gen 3, 16 Lanes (CPU only)

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Gen 2

2,411 million

Transistor Count

1,303 million

Memory Specifications

DDR3

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR3

Dual-channel

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Dual-channel

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

Radeon R7

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Radeon HD 8470D