Home / CPU Comparison / AMD EPYC 9135 or Intel Xeon 6505P: What's better?

AMD EPYC 9135

vs

Intel Xeon 6505P

CPU Comparison Result

Below are the results of a comparison of AMD EPYC 9135 and Intel Xeon 6505P processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD EPYC 9135

More Total Cores: 16 (16 vs 12)
Larger L3 Cache: 64 MB (64 MB vs 48 MB shared)

Intel Xeon 6505P

Newer Launch Date: February 2025 (October 2024 vs February 2025)

Basic

AMD

Label Name

Intel

October 2024

Launch Date

February 2025

Server

Platform

Server

EPYC 9135

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Xeon 6505P

Code Name

Granite Rapids

Foundry

Intel

Generation

Xeon 6 (Granite Rapids-SP)

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

3.65 GHz

Basic Frequency

Up to 4.3 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Performance-core Base Frequency

2.2 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

4.1 GHz

L1 Cache

112 KB per core

L2 Cache

2 MB per core

64 MB

L3 Cache

48 MB shared

Bus Frequency

100 MHz

SP5

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Intel Socket 4710

Multiplier

22.0

Unlocked Multiplier

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

5 nm

200W

TDP

150 W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

97°C

PCIe® 5.0 x128

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

Memory Specifications

DDR5

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5-6400

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

4 TB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Up to 6400 MT/s

Bus Speed

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Yes