Home / CPU Comparison / AMD A8-7600 or AMD FX-4350: What's better?

AMD A8-7600

vs

AMD FX-4350

CPU Comparison Result

Below are the results of a comparison of AMD A8-7600 and AMD FX-4350 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD A8-7600

Higher Technology: 28 nm (28 nm vs 32 nm)
Newer PCI Express Version: Gen 3, 16 Lanes (CPU only) (Gen 3, 16 Lanes (CPU only) vs Gen 2)
Newer Launch Date: July 2014 (July 2014 vs April 2013)

AMD FX-4350

Higher Max Turbo Frequency: up to 4.3 GHz (up to 3.8 GHz vs up to 4.3 GHz)

Basic

AMD

Label Name

AMD

July 2014

Launch Date

April 2013

Desktop

Platform

Desktop

A8-7600

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

FX-4350

Kaveri

Code Name

Vishera

A8 (Kaveri)

Generation

FX (Vishera)

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

3.1 GHz

Basic Frequency

4.2 GHz

up to 3.8 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

up to 4.3 GHz

256 KB

L1 Cache

288 KB

4 MB

L2 Cache

4 MB

L3 Cache

8 MB (shared)

100 MHz

Bus Frequency

200 MHz

AMD Socket FM2+

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AMD Socket AM3+

31.0x

Multiplier

19.5x

Yes

Multiplier Unlocked

28 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

32 nm

65 W

TDP

125 W

90°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

Gen 3, 16 Lanes (CPU only)

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Gen 2

2,411 million

Transistor Count

1,200 million

Memory Specifications

DDR3

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR3

Dual-channel

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Dual-channel

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

Radeon R7

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

On certain motherboards (Chipset feature)