AMD Ryzen 3 4300GE (OEM Only)
About processor
The AMD Ryzen 3 4300GE is a capable and efficient processor designed for desktop use. Built on TSMC's 7nm FinFET technology, this CPU features a total of 4 cores and 8 threads, making it suitable for multitasking and light productivity tasks. The 4MB of L3 cache ensures quick access to frequently used data, while the low 35W TDP makes it a great choice for small form factor and energy-efficient builds.
One of the standout features of the Ryzen 3 4300GE is its integrated Radeon™ Graphics, which offers decent performance for casual gaming and multimedia tasks without the need for a dedicated graphics card. This makes it an attractive option for budget-conscious users who still want to enjoy some light gaming on their desktop systems.
Overall, the AMD Ryzen 3 4300GE delivers a good balance of performance, power efficiency, and integrated graphics capabilities, making it a solid choice for home and office use. Whether you're building a compact PC for everyday tasks or looking for a budget-friendly processor with integrated graphics, the Ryzen 3 4300GE has a lot to offer.
Basic
Label Name
AMD
Platform
Desktop
Launch Date
July 2020
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
4
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
8
Basic Frequency
3.5GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 4.0GHz
L1 Cache
256KB
L2 Cache
2MB
L3 Cache
4MB
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
AM4
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 7nm FinFET
TDP
35W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
95°C
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 3.0
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
Bus Speed
Up to 3200MT/s
GPU Specifications
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
Radeon™ Graphics
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
1700 MHz